title: Intel array v2
status: Public on Dec 02 2011
contact.city: Oberlin
contact.first: Jordan
contact.last: Price
contact.state: OH
contact.address: 119 Woodland St
contact.country: USA
contact.institute: Oberlin College
organism: Homo sapiens
description: Photolithographic synthesis of peptides on silicon substrate
  Array patterning by photolithography and amino acid coupling. For wafer-scale array patterning, we used spin coater (Brewer Science, Rolla, MO) to apply a photosensitive imaging solution containing a photoacid generator and a sensitizer in propylene glycol methyl ether acetate (PGMEA, Sigma). In a class-10,000 clean room, we mounted wafers on a computer-controlled X-Y stage (Newport Corporation, Irvine, CA) and patterned array features by exposing selected areas of the wafer to UV light though a virtual mask with a digital exposure tool modified from a DLP device (Texas Instruments, Dallas, TX). At each coupling step, we treated UV-exposed wafers with coupling solution: [t-BOC amino acid of interest (Novabiochem, San Diego, CA), hydroxybenzotriazole (HOBt, CPC Scientific, Sunnyvale, CA), and N,N’-diisopropylcarbodiimide (DIC, CPC Scientific) dissolved in N-Methyl-2-pyrrolidone (NMP, Sigma) with a final concentration of 0.1 M each] for 30 min at room temperature (RT). After a brief rinse in N,N-dimethyl formamide (DMF, Sigma), we transferred wafers into capping solution (5% Ac2O in DMF). We then washed the wafers extensively in DMF and 2-propanol (IPA, Sigma) in preparation for the subsequent photolithography step.
manufacture_protocol: Wafer derivatization and linker attachment. We derivatized blank six-inch silicon wafers (Silicon Valley Microelectronics, Santa Clara, CA) by thermal oxidation followed by salination via immersion in a 0.5% v/v mixture of 3-aminopropyltriethoxysilane (Sigma-Aldrich, St. Louis, MO) in 95% ethyl alcohol (EtOH, Sigma) for 30 min at RT. We then cured wafers at 100 °C for 1 h under ultrapure and ultradry N2 (Airgas, Sacramento, CA) to crosslink silane groups to each other and to the silicon surface. Following salination, we added a PEG6 linker to the wafer surface to facilitate addition of custom peptides.