Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stress.
D000269:Adhesives; D004582:Electronics, Medical / Q000295:instrumentation*; D012828:Silicones; D013718:Tensile Strength; D013997:Time Factors; D014173:Transistors, Electronic
D000269:Adhesives; D012828:Silicones