title: A three-dimensional architecture for a parallel processing photosensing array.
abstract: A three-dimensional architecture for a photosensing array has been developed. This silicon based architecture consists of a 10 x 10 array of photosensors with 80 microns diameter, through chip interconnects to the back side of a 500 microns thick silicon wafer. Each photosensor consists of a 300 x 300 microns pn-junction photodiode. The following processes were used to create this photosensing architecture: 1) thermomigration of aluminum pads through an n-type silicon wafer; 2) creation of pn-junction photosensors on one side of the wafer; and 3) creation of aluminum pad ohmic contacts to the thermomigrated, through chip interconnects and the substrate on the back side of the wafer. The electrical and optical characteristics of the three-dimensional architecture indicates that it should be well suited as a photosensing framework around which a "silicon retina" could be built.
authors: Department of Electrical Engineering, University of Utah, Salt Lake City 84112.
authors: T
authors: T
authors: Johansson
authors: M
authors: M
authors: Abbasi
authors: R J
authors: RJ
authors: Huber
authors: R A
authors: RA
authors: Normann
mesh_terms: D001187:Artificial Organs; D004867:Equipment Design; D006801:Humans; D055095:Optics and Photonics / Q000295:instrumentation; D012160:Retina; D012825:Silicon; D013696:Temperature
chemical_list: D012825:Silicon