title: Temperature selective deposition of Parylene-C.
abstract: A new method for selectively depositing conformal, biocompatible coatings of Parylene-C on implantable integrated circuit structures is described. The technique consists of using thin film or diffused resistors to electrically heat the area where an opening in the Parylene is desired. Theoretically predicted and actual Parylene-C thickness are compared.
authors.affiliation: Department of Electrical and Computer Engineering, University of Missouri-Columbia 9104916.
authors.forename: E M
authors.initials: EM
authors.lastname: Charlson
authors.forename: E J
authors.initials: EJ
authors.lastname: Charlson
authors.forename: R
authors.initials: R
authors.lastname: Sabeti
mesh_terms: D001698:Biomedical Engineering / Q000295:instrumentation; D004553:Electric Conductivity; D004563:Electrochemistry; D004582:Electronics, Medical / Q000295:instrumentation*; D004595:Electroplating; D006358:Hot Temperature; D008855:Microscopy, Electron, Scanning; D011108:Polymers / Q000737:chemistry*; D019736:Prostheses and Implants; D013499:Surface Properties; D013696:Temperature; D013814:Thermal Conductivity; D014992:Xylenes / Q000737:chemistry*
chemical_list: D011108:Polymers; D014992:Xylenes; C011055:parylene