Improved adhesive method for microscopic examination of fungi in culture.
A new method for the examination of molds that involves the use of a device that dispenses a thin layer of a transparent adhesive material over the surface of a coverslip is described. The advantages of this method over previous methods used for the microscopic examination of molds are delineated.
Rodriguez-Tudela
J L
JL
Departament of Mycology, Carretera de Majadahonda a Pozuelo S/N, Madrid, Spain.
Aviles
P
P
D000269:Adhesives; D005658:Fungi / Q000254:growth & development / Q000302:isolation & purification*; D008853:Microscopy; D009172:Mycology / Q000379:methods*
D000269:Adhesives