title: Improved adhesive method for microscopic examination of fungi in culture.
abstract: A new method for the examination of molds that involves the use of a device that dispenses a thin layer of a transparent adhesive material over the surface of a coverslip is described. The advantages of this method over previous methods used for the microscopic examination of molds are delineated.
authors.affiliation: Departament of Mycology, Carretera de Majadahonda a Pozuelo S/N, Madrid, Spain.
authors.forename: J L
authors.initials: JL
authors.lastname: Rodriguez-Tudela
authors.forename: P
authors.initials: P
authors.lastname: Aviles
mesh_terms: D000269:Adhesives; D005658:Fungi / Q000254:growth & development / Q000302:isolation & purification*; D008853:Microscopy; D009172:Mycology / Q000379:methods*
chemical_list: D000269:Adhesives