Direct bonding with light-cured adhesives.
Hamula
W
W
D017438:Bisphenol A-Glycidyl Methacrylate; D003188:Composite Resins; D001840:Dental Bonding / Q000379:methods*; D006801:Humans; D016910:Orthodontic Brackets; D011109:Polymethacrylic Acids; D019279:Resin Cements
D003188:Composite Resins; D011109:Polymethacrylic Acids; D019279:Resin Cements; C065742:Transbond; D017438:Bisphenol A-Glycidyl Methacrylate; C047484:heliosit