A package design technique for size reduction of implantable bioelectronic systems.
This paper presents several substrate and package design techniques to minimize the overall size of bioelectronic systems, especially those that will be implanted for in vivo studies. The emphasis is on a new capacitor attachment and a new double-substrate design that have been successfully applied to the packaging of an implantable auditory prosthesis. The entire procedure for this case is described and compared with standard techniques to illustrate the advantages of this new approach in packaging.
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Department of Electrical Engineering, University of Washington, Seattle 98195.
D003054:Cochlear Implants; D004553:Electric Conductivity; D004581:Electronics / Q000295:instrumentation*; D004582:Electronics, Medical / Q000295:instrumentation*; D004867:Equipment Design; D008904:Miniaturization / Q000295:instrumentation*; D019736:Prostheses and Implants; D012815:Signal Processing, Computer-Assisted