title: Au, Cu, Sn, Zn and Ag ion release from some Cd-free gold solders.
abstract: The aim of this study was to determine the release of Au, Cu, Sn, Zn, and Ag from five commercially available Cd-free gold solders. The electropotential system in modified Fusayma solution was used. The cycle process was repeated between +/- 250 mV for 24 hours. To study the ion release, samples of solution were analysed during the process. Rapid release of Zn from most alloys was found. Cu and Ag ions were also released, but only small amounts of the latter. Au showed very good passivation up to 24 hours. The use of soldered joints should be reduced in order to minimize corrosion.
authors.forename: R
authors.initials: R
authors.lastname: Lappalainen
authors.forename: A
authors.initials: A
authors.lastname: Yli-Urpo
authors.forename: L
authors.initials: L
authors.lastname: Seppä
mesh_terms: D003300:Copper / Q000032:analysis; D012994:Dental Soldering; D006046:Gold / Q000032:analysis; D006047:Gold Alloys / Q000032:analysis*; D007477:Ions / Q000032:analysis; D012834:Silver / Q000032:analysis; D015032:Zinc / Q000032:analysis
chemical_list: D006047:Gold Alloys; D007477:Ions; D012834:Silver; D006046:Gold; D003300:Copper; D015032:Zinc