Strength properties of soldered joints for a gold-palladium alloy and a palladium alloy.
Strength of a soldered palladium alloy, PGC (Engelhard Corp.), and a soldered medium gold alloy, PGX (Engelhard Corp.), was examined. The results obtained were as follows: Highest strength was observed with postsoldered specimens of PGC alloy. Microstructural examination of postsoldered specimens revealed nearly pore-free solder joints with PGC and PGX alloys, and fracture appeared at the solder-alloy interface with PGC and PGX alloys. Microstructural examination of presoldered and presoldered/thermocycled specimens revealed that presoldered specimens of PGC and PGX alloys exhibited intrasolder fracture; PGX solder joints had considerably less porosity, which may explain the equivalent bond strengths of all the soldered specimens and the yield point of the controls; PGC solder joints exhibited large quantities of pores, which may explain the lower strength; pores observed in PGC alloy may be the result of the high fusing temperature of the solder; and these results indicate a need to develop a new presolder for PGC. The best result was obtained with postsoldered specimens of the PGC alloy. However, for PGX alloy, either postsolder or presolder techniques can be used.
D003722:Dental Alloys; D003776:Dental Porcelain; D012994:Dental Soldering; D006047:Gold Alloys; D006801:Humans; D008855:Microscopy, Electron, Scanning; D010165:Palladium; D013314:Stress, Mechanical; D013499:Surface Properties
D003722:Dental Alloys; D006047:Gold Alloys; C052483:palladium alloy PGC; D003776:Dental Porcelain; D010165:Palladium