Potentially lethal damage repair is due to the difference of DNA double-strand break repair under immediate and delayed plating conditions.
Cells plated immediately after irradiation on nutrient agar (immediate plating) exhibit a lower survival than cells which are kept under nongrowth conditions before plating (delayed plating). The difference between the survival curves obtained after immediate plating and delayed plating is considered to exhibit the cell's capacity to repair potentially lethal damage. In yeast evidence has been presented previously for the DNA double-strand break (DSB) as the molecular lesion involved in the repair of potentially lethal damage observed at the cellular level. Radiation-induced DSB are repaired in cells plated on nutrient agar, i.e., under growth conditions, as well as in cells kept under nongrowth conditions. In this paper DSB repair under growth and nongrowth conditions is studied with the help of the yeast mutant rad54-3 which is temperature conditional for DSB repair. It is shown that the extent of repair of potentially lethal damage can be varied by shifting the relative fractions of repair of DSB under growth conditions versus nongrowth conditions. Repair of DSB in cells plated on nutrient agar is promoted when glucose is substituted by Na-succinate as an energy source. As a result the immediate plating survival curve approaches the delayed plating survival curve, thus reducing the operationally defined repair of potentially lethal damage. We show that this reduced potentially lethal damage repair is caused, however, by a higher amount of DSB repair in cells immediately plated on succinate agar as compared to glucose agar.
Frankenberg-Schwager
M
M
Frankenberg
D
D
Harbich
R
R
D002455:Cell Division; D004247:DNA / Q000528:radiation effects*; D004260:DNA Repair; D004271:DNA, Fungal / Q000528:radiation effects; D004734:Energy Metabolism; D009154:Mutation; D012441:Saccharomyces cerevisiae / Q000254:growth & development / Q000378:metabolism / Q000528:radiation effects; D013997:Time Factors
D004271:DNA, Fungal; D004247:DNA