title: Creep in a palladium-enriched high-copper amalgam.
abstract: Palladium additions to a dispersed phase high-copper amalgam have been shown recently to suppress markedly the eta' (Cu6Sn5) concentration and decrease creep. A detailed study of the dental and 24 h creep for Pd containing high-copper amalgams and six commercial controls as a function of applied temperature and stress was performed. One part of Ag-Cu or Ag-Cu-Pd dispersants with substitutions of up to 20wt/o Pd for either Ag or Cu was blended with two parts of traditional amalgam alloy. Various temperatures from 25 to 60 degrees C and stresses from 36 to 72 MPa were applied to the samples during the test. For commercial controls and experimental amalgams with no Pd, creep is a strong function of temperature and stress. The experimental amalgam containing up to 10wt/o Pd, Pd substituted for Ag, demonstrated essentially constant creep over the temperature and stress range applied.
authors.affiliation: Department of Biological Materials, Dental School, Northwestern University, Chicago, IL 60611.
authors.forename: E H
authors.initials: EH
authors.lastname: Greener
authors.forename: K H
authors.initials: KH
authors.lastname: Chung
authors.forename: J H
authors.initials: JH
authors.lastname: Lin
mesh_terms: D055598:Chemical Phenomena; D002621:Chemistry; D003300:Copper; D003723:Dental Amalgam; D010165:Palladium; D013314:Stress, Mechanical
chemical_list: D010165:Palladium; D003300:Copper; D003723:Dental Amalgam