title: AC impedance measurements on high copper dental amalgams.
abstract: In recent years alloys with a high copper content were developed to improve the corrosion resistance of dental amalgam by elimination of the gamma 2 (Sn-Hg) phase. The purpose of the present investigation was to compare the electrochemical behaviour of high copper amalgams obtained from single composition amalgam alloys (Indiloy; Shofu, Dental Corp., Menlo Park, USA) with those that used the additive mode of copper alloying (Dispersalloy; Johnson & Johnson, East Windsor, USA).
mesh_terms: D003300:Copper / Q000032:analysis; D003343:Corrosion; D003722:Dental Alloys / Q000032:analysis; D003723:Dental Amalgam / Q000032:analysis; D004553:Electric Conductivity; D004563:Electrochemistry
chemical_list: D003722:Dental Alloys; D003300:Copper; D003723:Dental Amalgam