title: Interspinous process segmental spinal instrumentation.
abstract: A method for interspinous segmental spinal instrumentation (ISSI) is described and the laboratory testing and early clinical results are reported. The method utilizes a button-wire implant that is passed through the thickest and strongest part of the base of the spinous process. Tension tests show the stress-relieving qualities of the implant improve pullout strength 47% over simple wire fixation of the spinous process. Tests on the scoliosis simulator show that the interspinous instrumented spine resists high compressive loads to failure, comparing favorably with other systems tested. Early clinical experience with the implant for a wide variety of uses has been encouraging. The authors use ISSI as their procedure of choice in idiopathic and congenital scoliosis.
mesh_terms: D000293:Adolescent; D000328:Adult; D000818:Animals; D001696:Biomechanical Phenomena; D001858:Bone Nails; D002417:Cattle; D002648:Child; D005260:Female; D005500:Follow-Up Studies; D006801:Humans; D008297:Male; D011446:Prospective Studies; D019736:Prostheses and Implants; D011897:Random Allocation; D012600:Scoliosis / Q000601:surgery*; D016136:Spina Bifida Occulta / Q000601:surgery; D013123:Spinal Fusion / Q000295:instrumentation* / Q000379:methods; D013131:Spine / Q000503:physiopathology; D013193:Stainless Steel
chemical_list: D013193:Stainless Steel