Influence of non-homology between recombining DNA sequences on double-strand break repair in Saccharomyces cerevisiae.
In this paper we study the influence of non-homology between plasmid and chromosomal DNA on the efficiency of recombinational repair of plasmid double-strand breaks and gaps in yeast. For this purpose we used different combinations of plasmids and yeast strains carrying various deletions within the yeast LYS2 gene. A 400 bp deletion in plasmid DNA had no effect on recombinational plasmid repair. However, a 400 bp deletion in chromosomal DNA dramatically reduced the efficiency of this repair mechanism, but recombinational repair of plasmids linearized by a double-strand break with cohesive ends still remained the dominant repair process. We have also studied the competition between recombination and ligation in the repair of linearized plasmids. Our experimental evidence suggests that recombinational repair is attempted but aborted if only one recombinogenic end with homology to chromosomal DNA is present in plasmid DNA. This situation results in a decreased probability of non-recombinational (i.e. ligation) repair of linearized plasmid DNA.
Glasunov
A
A
Institute for Genetics of Industrial Microorganisms, Moscow, Russia.
Frankenberg-Schwager
M
M
Frankenberg
D
D
D015825:Chromosomes, Fungal / Q000235:genetics; D004260:DNA Repair; D004271:DNA, Fungal / Q000235:genetics*; D005785:Gene Conversion; D005800:Genes, Fungal; D010957:Plasmids / Q000235:genetics; D011995:Recombination, Genetic; D012441:Saccharomyces cerevisiae / Q000235:genetics*; D017384:Sequence Deletion; D012689:Sequence Homology, Nucleic Acid; D014170:Transformation, Genetic
D004271:DNA, Fungal