title: Tensile bond strength and curing gap formation of a dentin bonding resin.
abstract: Tensile bond strength and contraction gap tests were carried out using a new dentin bonding resin in association with various dentin conditioning and priming materials in vitro. For the tensile bond test, significant differences were found between the nonconditioned and conditioned dentin, and the primed and non-primed dentin surfaces. The strongest bond was obtained using a combination of phosphoric acid conditioning and priming with HEMA in glutaraldehyde at 151.3 kgf/cm2. Gap test results showed the presence of gaps in all of the test groups, but with variation in the extent of gap formation. A not significant, inverse correlation was determined between the tensile bond strength and gap tests (R = -0.65). The new bonding resin obtained good bond strengths in all cases, but high bond strengths can only be obtained with a combination of etching and priming. Similarly, the smallest gaps were associated with the etched and primed groups.
authors.affiliation: Department of Operative Dentistry, Tokyo Medical and Dental University, Japan.
authors.forename: M F
authors.initials: MF
authors.lastname: Burrow
authors.forename: M
authors.initials: M
authors.lastname: Hayashida
authors.forename: T
authors.initials: T
authors.lastname: Negishi
authors.forename: T
authors.initials: T
authors.lastname: Nikaido
authors.forename: J
authors.initials: J
authors.lastname: Tagami
authors.forename: T
authors.initials: T
authors.lastname: Takatsu
authors.forename: H
authors.initials: H
authors.lastname: Hosoda
mesh_terms: D000818:Animals; D002417:Cattle; D001840:Dental Bonding; D003737:Dental Cavity Preparation; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D008422:Materials Testing; D008689:Methacrylates / Q000737:chemistry*; D008855:Microscopy, Electron, Scanning; D012044:Regression Analysis; D013499:Surface Properties; D013718:Tensile Strength; D013997:Time Factors
chemical_list: D017220:Dentin-Bonding Agents; D008689:Methacrylates; C086114:PAAMA 2