title: Metal release from high-copper amalgams containing palladium.
abstract: BACKGROUND
  High-copper amalgam containing palladium has been successfully developed. However, the effect of palladium on the release of corrosion products remains unknown. We studied the effect of palladium addition on the electrochemical properties of amalgams by measuring the amount of the elements released from the experimental Pd-containing amalgams into Ringer's solution.
  
  
  METHODS
  A series of specimens of high-copper amalgams containing different concentrations of palladium, from 0.42 w% to 3.33 w% in the final amalgam, fabricated from a blend of traditional amalgam alloy and copper-silver-palladium ternary alloy, were subjected to free corrosion in Ringer's solution at 37 degrees C for 3 months. Aliquots of 10 microL of electrolyte were removed serially with time, and the concentrations of Ag, Sn, Cu, Pd and Zn were evaluated by graphite furnace atomic absorption technique. In addition, dissolved Hg was evaluated by cold vapor atomic absorption technique in the same aliquotes. Various kinds of commercial amalgam including traditional (Spheraloy), high-copper blends (Dispersalloy and Valiant-Ph.D.) and high-copper spherical (Valiant) were employed as controls.
  
  
  RESULTS
  Ag and Sn cations released from the amalgams containing palladium were similar in concentration to those released from the commercial amalgams. The concentrations of released Cu and Hg cations decreased as a function of increased Pd concentration in the experimental amalgams. Averaging an order of magnitude of released Cu and Hg cations less than commercial controls for amalgam containing 1.7 w% Pd. Detection of Pd was essentially below the resolution of the technique and Zn was only detected in case of Dispersalloy.
  
  
  CONCLUSIONS
  Pd addition to high-copper amalgam alloy reduces the release of mercury and copper from the Pd-containing amalgam.
authors.affiliation: School of Dentistry, National Yang-Ming Medical College, Taipei, Taiwan, R.O.C.
authors.forename: T H
authors.initials: TH
authors.lastname: Lin
authors.forename: C C
authors.initials: CC
authors.lastname: Chan
authors.forename: K H
authors.initials: KH
authors.lastname: Chung
mesh_terms: D003300:Copper / Q000737:chemistry*; D003343:Corrosion; D003723:Dental Amalgam / Q000737:chemistry*; D004563:Electrochemistry; D008628:Mercury / Q000737:chemistry*; D010165:Palladium / Q000009:adverse effects* / Q000032:analysis
chemical_list: D010165:Palladium; D003300:Copper; D003723:Dental Amalgam; D008628:Mercury