Copper thick film sintering studies in an environmental scanning electron microscope.
The significance of the ElectroScan environmental scanning electron microscope (ESEM) as a processing tool for studying dynamic morphological changes under controlled temperature/atmosphere conditions was evaluated. The ability to observe dynamic processes in situ, which cannot be achieved by other means, is critical to understanding microstructural formation. Processing of printed copper thick films on ceramics was used as a test case, wherein morphological changes associated with the steps of organic binder removal and sintering of copper particles were observed/examined in real time. Good agreement was seen between microstructures obtained in the ESM and those achieved in a belt furnace when similar process variables were used. When processed in atmospheres which were proven to induce sintering in a conventional belt furnace, sintering was evident in both cases, and the microstructural changes were documented on video-tapes in real time. Determination of critical event temperatures was achieved--that is, binder burnout occurring between 270 degrees and 350 degrees C, onset of oxidation at 520 degrees C, and sintering starting at 770 degrees C. It was thus verified that the microstructural changes during the copper thick film sintering process can be observed in situ using an ESEM.
BOC Group, Inc., Technical Center, Murray Hill, New Jersey 07974.
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D003217:Conductometry; D003300:Copper / Q000737:chemistry*; D008855:Microscopy, Electron, Scanning
D003300:Copper