title: Effect of interfacial variables on metal-porcelain bonding.
abstract: While ceramic-to-metal bonding has been used in many applications, the actual chemical and physical factors leading to optimum bond strength are not well understood. In this work, several variables affecting the bonding between dental porcelain and a palladium alloy (85% Pd, 10% Cu, and 5% Ga) were investigated: 1) precoating the metal by sputtering various oxides before porcelaining; 2) peroxidation of the metal base before porcelaining; 3) porcelaining under reducing atmosphere; and 4) surface roughening at controlled levels before porcelaining. Using a modification of the push doughnut shear bond strength test to measure bond strength the following results were obtained. 1) Compared with standard "control" samples, the aluminum oxide precoated specimens showed a bond strength improvement of 46%, while the copper, manganese, and tin oxide precoatings exhibited smaller effects. 2) Preoxidation of the metal base led to pronounced bond strengthening (152%) by surface roughening as well as oxide formation. 3) Porcelaining under a reducing atmosphere severely reduced bond strength (88% lower than the controls) indicating the role of oxidation during the standard firing cycle. 4) Mechanical roughening of the surface by controlled amounts gave pronounced improvements with greater notch depth. Coarse roughening produced the highest bond strength improvements (486%).
authors: Department of Biologic and Materials Sciences, School of Dentistry, University of Michigan, Ann Arbor 48109-1078.
authors: W C
authors: WC
authors: Wagner
authors: K
authors: K
authors: Asgar
authors: W C
authors: WC
authors: Bigelow
authors: R A
authors: RA
authors: Flinn
mesh_terms: D003300:Copper; D003722:Dental Alloys; D003776:Dental Porcelain; D005708:Gallium; D008670:Metals; D008854:Microscopy, Electron; D008855:Microscopy, Electron, Scanning; D010165:Palladium; D013718:Tensile Strength
chemical_list: D003722:Dental Alloys; D008670:Metals; D003776:Dental Porcelain; D010165:Palladium; D003300:Copper; D005708:Gallium