Successive cusp build-up: an improved placement technique for posterior direct resin restorations.
Liebenberg
W H
WH
D000134:Acid Etching, Dental; D000269:Adhesives; D001641:Bicuspid; D003188:Composite Resins; D001840:Dental Bonding; D003736:Dental Cavity Lining; D003737:Dental Cavity Preparation / Q000379:methods; D003793:Dental Restoration, Permanent / Q000379:methods*; D017220:Dentin-Bonding Agents; D006801:Humans; D007258:Informed Consent; D008963:Molar; D016733:Rubber Dams
D000269:Adhesives; D003188:Composite Resins; D017220:Dentin-Bonding Agents