Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.
To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.
Kawada
E
E
Department of Dental Materials Science, Tokyo Dental College, Chiba, Japan.
Sakurai
Y
Y
Oda
Y
Y
D003343:Corrosion; D012994:Dental Soldering / Q000706:statistics & numerical data; D004563:Electrochemistry; D008422:Materials Testing / Q000295:instrumentation / Q000379:methods / Q000706:statistics & numerical data; D016876:Metal Ceramic Alloys / Q000737:chemistry*; D010165:Palladium / Q000737:chemistry*
D016876:Metal Ceramic Alloys; D010165:Palladium