Design and fabrication of topologically complex, three-dimensional microstructures
Two concepts for use in the fabrication of three-dimensional (3D) microstructures with complex topologies are described. Both routes begin with a two-dimensional (2D) pattern and transform it into a 3D microstructure. The concepts are illustrated by use of soft lithographic techniques to transfer 2D patterns to cylindrical (pseudo-3D) substrates. Subsequent steps-application of uniaxial strain, connection of patterns on intersecting surfaces-transform these patterns into free-standing, 3D, noncylindrically symmetrical microstructures. Microelectrodeposition provides an additive method that strengthens thin metal designs produced by patterning, welds nonconnected structures, and enables the high-strain deformations required in one method to be carried out successfully.
Jackman
RJ
R. J. Jackman, S. T. Brittain, G. M. Whitesides, Department of Chemistry and Chemical Biology, Harvard University, 12 Oxford Street, Cambridge, MA 02138, USA. A. Adams and M. G. Prentiss, Department of Physics, Harvard University, 9 Oxford Stree.
Brittain
ST
Adams
A
Prentiss
MG
Whitesides
GM