Procedures for enamel and dentin conditioning: a comparison of conventional and innovative methods.
Composite materials have become an integral part of the wide range of filling materials currently available. Conditioning is necessary to achieve adequate bonding of the composite material to enamel and dentin. Normally, this is done by applying acid preparations to the dental surfaces. These acids have an etching effect that causes surface roughening. The increasing application of lasers in dentistry has introduced another possibility. Laser irradiation can cause roughening of enamel and dentin surfaces. Another interesting alternative is the so-called kinetic cavity preparation technique. This method also results in distinct surface roughening. The purpose of the present study, was to compare the described methods. Tensile bond strength tests and shear bond tests were carried out to examine the adhesion of a composite material to surfaces treated with these methods. Laser irradiation with certain devices and the air-abrasive technique yielded results similar to those with acid etching.
Department of Conservative Dentistry, Dental School, University of Vienna, Austria.
A
A
Moritz
U
U
Schoop
K
K
Goharkhay
S
S
Szakacs
W
W
Sperr
E
E
Schweidler
J
J
Wernisch
N
N
Gutknecht
D000134:Acid Etching, Dental / Q000379:methods; D000399:Air Pressure; D002245:Carbon Dioxide; D003188:Composite Resins; D001840:Dental Bonding / Q000379:methods*; D003737:Dental Cavity Preparation / Q000379:methods*; D003743:Dental Enamel / Q000187:drug effects / Q000528:radiation effects; D003804:Dentin / Q000187:drug effects / Q000528:radiation effects; D004871:Erbium; D006801:Humans; D007834:Lasers; D008298:Maleates; D008422:Materials Testing; D009354:Neodymium; D010756:Phosphoric Acids; D011188:Potassium; D012666:Semiconductors; D012822:Silicon Dioxide; D013499:Surface Properties; D013718:Tensile Strength; D015040:Zirconium
D003188:Composite Resins; D008298:Maleates; D010756:Phosphoric Acids; C083568:Z100 composite resin; D002245:Carbon Dioxide; D009354:Neodymium; D012822:Silicon Dioxide; D004871:Erbium; C030272:maleic acid; D015040:Zirconium; C030242:phosphoric acid; D011188:Potassium