A high-yield microassembly structure for three-dimensional microelectrode arrays.
This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.
Bai
Q
Q
Advanced Technology Department, Guidant Corporation, St. Paul, MN 55112-5798, USA.
Wise
K D
KD
Anderson
D J
DJ
D000818:Animals; D001303:Auditory Cortex / Q000502:physiology; D001921:Brain / Q000473:pathology* / Q000502:physiology*; D002415:Cats; D004567:Electrodes, Implanted; D004569:Electroencephalography; D004867:Equipment Design; D006046:Gold; D006168:Guinea Pigs; D008839:Microelectrodes; D018613:Microscopy, Confocal; D012815:Signal Processing, Computer-Assisted; D012825:Silicon
D006046:Gold; D012825:Silicon