title: Speeding-up the cure of one-part silicone rubber, when encapsulating neurological prostheses: the permeable mould.
abstract: The Note describes a procedure for encapsulating the implantable microelectronics in an air-curing silicone rubber, by which the shape of the casting is fully defined, and cure is achieved within an acceptable time.
authors.affiliation: Implanted Devices Group, Department of Medical Physics and Bioengineering, University College London, 11-20 Capper St, WC1E 6JA, London, UK.
authors.forename: N N
authors.initials: NN
authors.lastname: Donaldson
authors.forename: P E
authors.initials: PE
authors.lastname: Donaldson
mesh_terms: D001698:Biomedical Engineering; D004582:Electronics, Medical / Q000295:instrumentation*; D006801:Humans; D019635:Neurosurgical Procedures; D011474:Prosthesis Design; D012826:Silicone Elastomers
chemical_list: D012826:Silicone Elastomers