[Repair of dual-stranded DNA in Saccharomyces cerevisiae cells: homolog-dependent ligation and role of the RAD55 gene].
In our previous works, a mutation in the RAD57 gene was shown to induce the plasmid DNA double-strand gap (DSG) repair via a special recombinational repair mechanism: homolog-dependent ligation responsible for reuniting disrupted plasmid ends without reconstructing the sequence lost because of the DSG. In this work, the role of the RAD55 gene in the plasmid DNA DSG repair was studied. A cold-sensitive rad55-3 mutation markedly decreased the precision of plasmid DNA DSG repair under conditions of restrictive temperature (23 degrees C): only 5-7% of plasmids can repair DSG, whereas under permissive conditions (36 degrees C), DSGs were repaired in approximately 50% of the cells. In the cold-sensitive mutation rad57-1, the proportion of plasmids in which DSGs were repaired was nearly the same under both permissive and restrictive conditions (5-10%). The results indicate that a disturbance in the function of the RAD55 gene, as in the RAD57 gene, leads to a drastic increase in the contribution of homolog-dependent ligation to the repair of double-strand DNA breaks.
Glazunov
A V
AV
State Research Institute of Genetics and Selection of Industrial Microorganisms, Moscow, 113545 Russia. glasunov@genetika.ru
Glazer
V M
VM
D004249:DNA Damage; D004260:DNA Repair / Q000235:genetics*; D004268:DNA-Binding Proteins; D005656:Fungal Proteins / Q000235:genetics*; D005800:Genes, Fungal; D009154:Mutation; D010957:Plasmids; D011995:Recombination, Genetic; D012441:Saccharomyces cerevisiae / Q000235:genetics*; D029701:Saccharomyces cerevisiae Proteins
D004268:DNA-Binding Proteins; D005656:Fungal Proteins; C087191:RAD55 protein, S cerevisiae; D029701:Saccharomyces cerevisiae Proteins