WDX study of resin-dentin interface on wet vs. dry dentin.
The purpose of the present study was to determine the resin-dentin Interface conditions in Wet vs. Dry Dentin. Dentin disks were prepared from extracted human premolars. Sectioned dentin surfaces were used for SEM studies of wet vs. dried acid-etched dentin. These specimens were cut perpendicular to the surface into two equal halves. One-half of the sectioned specimen was observed by SEM in three treatment groups and the other half was observed for micromorphological differences in the resin-dentin interface using Wavelength Dispersive X-ray Spectrometer (WDX). SEM photomicrographs of the dentin surface showed the collapse of collagen fibrils in the demineralized layer and enlargement of the tubule orifices. A collagen rich layer approximately 8-10 microns thick (WDX) was observed at the resin-dentin interface when treated with the conventional dry-bonding technique. Dentin surfaces treated by the wet-bonding technique (SB), as observed by SEM, showed an uncollapsed collagen layer, while the collagen-rich layer was approximately 1-2 microns thick (WDX). The present findings suggest that moist bonding is required for optimum infiltration of adhesive resin into the demineralized layer.
Han
L
L
Department of Operative Dentistry and Endodontics, Niigata University School of Dentistry, 5274 Gakkocho-dori 2-bancho Niigata 951-8514, Japan.
Abu-Bakr
N
N
Okamoto
A
A
Iwaku
M
M
D000134:Acid Etching, Dental; D017438:Bisphenol A-Glycidyl Methacrylate / Q000737:chemistry; D003094:Collagen / Q000648:ultrastructure; D001840:Dental Bonding / Q000379:methods*; D003804:Dentin / Q000648:ultrastructure*; D003806:Dentin Permeability; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D004577:Electron Probe Microanalysis; D006801:Humans; D008855:Microscopy, Electron, Scanning; D019279:Resin Cements / Q000737:chemistry*; D013499:Surface Properties; D014867:Water / Q000737:chemistry
D017220:Dentin-Bonding Agents; D019279:Resin Cements; C115612:single bond; D014867:Water; C074669:Clearfil Photo Bond; D017438:Bisphenol A-Glycidyl Methacrylate; D003094:Collagen