title: Direct observation of a Ti/Cu interface with atomic displacement under electron irradiation.
abstract: A Ti film was deposited onto a Cu substrate by means of a radio frequency magnetron sputtering
  
  
  METHODS
  Cross-sectional thin foils for TEM observation were prepared using a focused ion beam. Electron irradiation was carried out using a high-resolution high-voltage electron microscope operated at 1.25 MV. The Cu/Ti interface of the foils was irradiated at 623 K. In-situ observation images during electron irradiation were recorded by a CCD camera with a digital video cassette. The (020)Cu plane on the Cu/Ti interface preferentially moved towards the Ti film with irradiation. Composition analysis of the diffused region showed that its composition corresponded to Ti3Cu2.
authors.affiliation: JEOL Ltd, Musashino 3-1-2, Akishima 196-8558, Japan.
authors.forename: S
authors.initials: S
authors.lastname: Ohta
authors.forename: N
authors.initials: N
authors.lastname: Sakaguchi
authors.forename: T
authors.initials: T
authors.lastname: Shibayama
authors.forename: H
authors.initials: H
authors.lastname: Takahashi