Telesensor integrated circuits.
Progress in personal computing has recently permitted small research programs to design and simulate application-specific integrated circuits (ASICs). Inexpensive fabrication of silicon chips can then be obtained using chip foundries, and quite complex circuits can be greatly reduced in size with an accompanying increase in certain performance characteristics. Within the past 5 years it has also become possible to design ASICs which can transmit and receive radio signals and which thus may be employed in applications in which wired connections for input and output of signals are not practicable. We are currently developing research-grade prototype ASICs for the monitoring of human vital signs. In this case one or more sensors placed on an ASIC provides a signal to be transmitted a distance of 2-3 meters to a receiver/display unit. The use of ASIC telesensors provides the possibility of wireless monitoring, including long-term monitoring, with inexpensive and unencumbering devices. Their self-contained nature permits a number of potential uses in future biomedical applications as new sensors are devised which are amenable to deployment on silicon.
Ferrell
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Oak Ridge National Laboratory, Tennessee 37831, USA. f44@ornl.gov
Britton
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Bryan
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Clonts
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Emery
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Ericson
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Merraudeau
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Morrison
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Passian
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A
Smith
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Threatt
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Turner
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Wintenberg
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D001152:Arsenicals; D001831:Body Temperature; D004582:Electronics, Medical; D004867:Equipment Design; D005544:Forecasting; D005708:Gallium; D006801:Humans; D008904:Miniaturization; D008991:Monitoring, Physiologic / Q000295:instrumentation* / Q000639:trends; D012825:Silicon; D014173:Transistors, Electronic
D001152:Arsenicals; C043055:gallium arsenide; D005708:Gallium; D012825:Silicon