Influence of metal ion sorption on colloidal surface forces measured by atomic force microscopy.
Atomic force microscopy (AFM) is employed to directly measure colloidal surface forces between a silica particle and a smooth glass plate in an aqueous solution with or without the presence of copper ions. Without the presence of copper ions, results show that the force between these two surfaces is repulsive and that its magnitude decreases with increasing ionic strength and decreasing pH. The surface forces are calculated based on the Derjaguin-Landau-Verwey-Overbeek (DLVO) theory for constant surface charge and are then compared with AFM force measurements. A good agreement between theory and experimental data is reported except at very small separation distances (<3 nm) between the silica particle and the glass plate. This behavior may be attributed to non-DLVO forces, such as the hydration effect that results from the bounded water molecules on the surface of the silica particle, or to surface roughness. When copper ions are present in acidic aqueous solutions, the magnitude of the force is found to be the same as that without the presence of copper ions, which indicates that no sorption of copper ions by the silica particle occurs under these conditions. Near neutral pH, sorption of copper ions causes charge reversal for the silica particle from negative to positive. Therefore, the force between the silica particle and the glass plate changes from repulsive to attractive. The transient zeta-potential of the silica particle during sorption of copper ions is determined by representing the experimental data with the DLVO theory. In alkaline solutions, where removal of copper ions is known to occur mainly by bulk precipitation, the measured force is similar to that without the presence of copper ions, which suggests that sorption does not occur under such conditions.
Chin
Ching-Ju
CJ
School of Civil and Environmental Engineering, Georgia Institute of Technology, Atlanta 30332-0512, USA.
Yiacoumi
Sotira
S
Tsouris
Costas
C
D003102:Colloids; D003300:Copper / Q000737:chemistry*; D006863:Hydrogen-Ion Concentration; D007477:Ions; D018625:Microscopy, Atomic Force; D010316:Particle Size; D012822:Silicon Dioxide / Q000737:chemistry*; D014873:Water Pollutants / Q000032:analysis*
D003102:Colloids; D007477:Ions; D014873:Water Pollutants; D012822:Silicon Dioxide; D003300:Copper