Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications.
We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 x 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented.
Lacroix
Frederic
F
Department of Electrical and Computer Engineering, McGill University, Montréal, Québec, Canada. fredl@photonics.ece.mcgill.ca
Bernier
Eric
E
Ayliffe
Michael H
MH
Tooley
Frank A P
FA
Plant
David V
DV
Kirk
Andrew G
AG