title: Design on semiconductor coupled SAW convolver.
abstract: This paper presents results of a design study on a semiconductor coupled surface acoustic wave (SAW) convolver in which bi-directionally propagating SAWs, on a piezoelectric substrate with a high coupling coefficient, couple with bonded semiconductor diodes through multistrips. To obtain convolution signals with a high efficiency, we adopted a diode-balanced bridge structure for the non-linear operation. We also found that the tapping pitches of the multi-strip electrodes have robustness against operation frequency variation and temperature-dependent variation on the delay of the SAW. We verified the effectiveness of the device in a circuit simulation and an experiment on a test circuit, which was fabricated by using an epitaxial lift-off film-bonding process.
authors: Kanagawa Institute of Technology, Japan. hohkawa@ele.kanagawa-it.ac.jp
authors: Kohji
authors: K
authors: Hohkawa
authors: Takaya
authors: T
authors: Suda
authors: Yusuke
authors: Y
authors: Aoki
authors: Chulun
authors: C
authors: Hong
authors: Chinami
authors: C
authors: Kaneshiro
authors: Keishin
authors: K
authors: Koh