title: Vesicle budding from endoplasmic reticulum.
authors.affiliation: Genetech, Inc., South San Francisco, California 94080, USA.
authors.forename: Yuval
authors.initials: Y
authors.lastname: Shimoni
authors.forename: Randy
authors.initials: R
authors.lastname: Schekman
mesh_terms: D022181:COP-Coated Vesicles / Q000648:ultrastructure*; D004721:Endoplasmic Reticulum / Q000648:ultrastructure*; D015003:Yeasts / Q000648:ultrastructure