title: Role of cell surface components on Cu2+ adsorption by Pseudomonas putida 5-x isolated from electroplating effluent.
abstract: A gram-negative bacterium Pseudomonas putida 5-x with high Cu2+ accumulating capability was isolated from electroplating effluent in Kwun Tong, Hong Kong. The pretreated cells without superficial layer-capsule, isolated cell envelopes and the separated peptidoglycan layer materials were obtained from fresh P. putida 5-x cells, their Cu2+ adsorption capacities and properties were compared with that of the fresh cells. Pretreatment by 0.1 mol L(-1) HCl enhanced Cu2+ adsorption capacity due to the degradation of cell superficial layer-capsule of P. putida 5-x cells. Isolated cell envelopes possessed five times more Cu2+ adsorption capacity than that of fresh intact cell. The Cu2+ adsorption of separated peptidoglycan layer materials indicated that the peptidoglycan layer only played 10-15% part of the Cu2+ adsorption capacity, and implied other cell surface components such as outer membrane or inner membrane might play an important role in such high Cu2+ binding of the cell envelopes. The adsorption process of fresh cells, pretreated cells and cell envelopes of P. putida 5-x could be described with Freundlich isotherm, while the adsorption of Cu2+ by separated peptidoglycan layer materials was better described with Langmuir isotherm.
authors.affiliation: Department of Civil and Structural Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong. 99900170r@polyu.edu.hk
authors.forename: L
authors.initials: L
authors.lastname: Wang
authors.forename: H
authors.initials: H
authors.lastname: Chua
authors.forename: Q
authors.initials: Q
authors.lastname: Zhou
authors.forename: P K
authors.initials: PK
authors.lastname: Wong
authors.forename: S N
authors.initials: SN
authors.lastname: Sin
authors.forename: W L
authors.initials: WL
authors.lastname: Lo
authors.forename: P H
authors.initials: PH
authors.lastname: Yu
mesh_terms: D000327:Adsorption; D003300:Copper / Q000493:pharmacokinetics*; D004595:Electroplating; D007220:Industrial Waste; D016958:Pseudomonas putida / Q000502:physiology*; D013696:Temperature; D014873:Water Pollutants / Q000493:pharmacokinetics*; D018508:Water Purification / Q000379:methods*
chemical_list: D007220:Industrial Waste; D014873:Water Pollutants; D003300:Copper