Resin-enamel bonds made with self-etching primers on ground enamel.
Self-etching primer adhesives have recently been introduced to simplify bonding. However, the fundamental bonding mechanism of self-etching primers to enamel is not yet fully understood. This study aimed to investigate resin-enamel bonds of self-etching primer adhesives on ground enamel. Two self-etching primer adhesives (Clearfil Liner Bond 2 V and Clearfil SE Bond) were used in this study. A total-etch adhesive (One-Step) was used as a control. Resin-enamel beams were subjected to the microtensile bond test. Subsequently, the failure modes of all specimens were quantified using image analysis. Undemineralized and demineralized ultrathin sections of the resin-enamel bonded specimens were examined using transmission electron microscopy. The bond strengths of Clearfil SE Bond (39.8 +/- 11.9 MPa) and One-Step (46.2 +/- 12.7 MPa) were significantly greater than that of Clearfil Liner Bond 2V (30.4 +/- 6.2 MPa). Scanning electron microscopy of the fractured surfaces revealed the failure direction and weakest portion within each bond. Transmission electron microscopy showed a thin hybridized complex of resin in enamel produced by the self-etching primers without the usual micrometer-sized resin tags seen in resin-enamel bonds produced using the total-etch adhesive. The morphological features of the resin-enamel bonds produced by two self-etching primers tested were different from that created with the total-etch adhesive.
Hashimoto
Masanori
M
Division of Pediatric Dentistry, Hokkaido University, Graduate School of Dental Medicine, Sapporo, Hokkaido, Japan. masanori-h@mue.biglobe.ne.jp
Ohno
Hiroki
H
Yoshida
Eiji
E
Hori
Minoru
M
Sano
Hidehiko
H
Kaga
Masayuki
M
Oguchi
Haruhisa
H
D000269:Adhesives; D001840:Dental Bonding; D003743:Dental Enamel / Q000648:ultrastructure*; D045662:Dental Etching; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D006801:Humans; D007091:Image Processing, Computer-Assisted; D008422:Materials Testing; D008689:Methacrylates / Q000737:chemistry; D008854:Microscopy, Electron; D008855:Microscopy, Electron, Scanning; D019279:Resin Cements / Q000737:chemistry; D013499:Surface Properties; D013718:Tensile Strength
D000269:Adhesives; C103506:Bis-GMA, BPDM, HEMA dental-bonding resin; C112274:Clearfil Liner Bond 2; C438313:Clearfil SE Bond; D017220:Dentin-Bonding Agents; D008689:Methacrylates; D019279:Resin Cements