title: Cure monitoring using ultrasonic guided waves in wires.
abstract: The possibility of using ultrasonic guided waves for monitoring the cure process of epoxy resins is investigated. The two techniques presented use a wire waveguide which is partly embedded in the resin. The first technique is based on the measurement of attenuation due to leakage of bulk waves into the resin surrounding the waveguide. The second technique measures the reflection of the guided wave that occurs at the point where the waveguide enters the resin. Both the attenuation and the reflection coefficient change significantly during cure, and the numerical methods to relate these to the material properties of the curing resin are presented in this paper. The results from the modeling are experimentally verified and show good agreement. The applicability of each testing method is discussed, and typical cure-monitoring curves are presented.