title: Optical nonreciprocal devices with a silicon guiding layer fabricated by wafer bonding.
abstract: Optical nonreciprocal devices with a silicon guiding layer fabricated by wafer bonding are proposed. The optical nonreciprocal devices are composed of a magneto-optic waveguide with a magnetic garnet/Si/SiO2 structure. Nonreciprocal characteristics are obtained by an evanescent field penetrating into the upper magnetic garnet cladding layer. Several kinds of the optical nonreciprocal device are investigated with the magneto-optic waveguide and designed at a wavelength of 1.55 microm. As a preliminary experiment, wafer bonding between Gd3Ga5O12 and Si was studied. Wafer bonding was successfully achieved with heat treatment at 220 degrees C in H2 ambient.
authors.affiliation: Department of Electrical and Electronic Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan. yokoi@wave.pe.titech.ac.jp
authors.forename: Hideki
authors.initials: H
authors.lastname: Yokoi
authors.forename: Tetsuya
authors.initials: T
authors.lastname: Mizumoto
authors.forename: Yuya
authors.initials: Y
authors.lastname: Shoji