Effect of posterior resin composite placement technique on the resin-dentin interface formed in vivo.
OBJECTIVE
The aim of this study was to evaluate the morphology of the resin-dentin interface formed in vivo with two posterior resin composite placement techniques (incremental and bulk).


METHODS
After approval from the patients, 12 Class II cavities with margins in enamel (2.5 x 2.5 x 4.5 mm) were prepared in caries-free premolars scheduled to be extracted for orthodontic reasons (n = 6). The cavities were restored with Single Bond + Filtek P60 as a bulk condensable technique or Single Bond + Filtek Z250 as an oblique incremental technique. After 1 week, the teeth were extracted with minimal trauma to the restored area. After the teeth were sectioned, a polyvinyl siloxane impression was taken from the resin-dentin interface to control for artifacts created during preparation for scanning electron microscopy. The specimens were subsequently processed for and observed under a scanning electron microscope to assess gap formation.


RESULTS
The mean percentage of gap formation was 6.1% for teeth restored with the incremental placement technique and 18.7% for teeth restored with the bulk placement technique. The difference was statistically significant.


CONCLUSIONS
The incremental placement of posterior resin composites may still provide better seal than the new bulk condensable technique.
Lopes
Guilherme Carpena
GC
Department of Operative Dentistry, Universidade Federal de Santa Catarina, Florianópolis, Brazil. guilherme_lopes@ig.com.br
Baratieri
Luiz Narciso
LN
Monteiro
Sylvio
S
Vieira
Luiz Clóvis Cardoso
LC
D001641:Bicuspid; D017438:Bisphenol A-Glycidyl Methacrylate; D003188:Composite Resins; D018772:Dental Marginal Adaptation; D003793:Dental Restoration, Permanent / Q000379:methods*; D003804:Dentin; D017220:Dentin-Bonding Agents; D006801:Humans; D008855:Microscopy, Electron, Scanning
D003188:Composite Resins; D017220:Dentin-Bonding Agents; C444701:Filtek Z250; C443708:P60 Condensible Resin Composite; C115612:single bond; D017438:Bisphenol A-Glycidyl Methacrylate