Configurations of high-frequency ultrasonics complex vibration systems for packaging in microelectronics.
Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk.
Tsujino
Jiromaru
J
Faculty of Engineering, Kanagawa University, 3-27-1 Rokkakubashi, Kanagawa-ku, Yokohama 221-8686, Japan. tsujino@cc.kanagawa-u.ac.jp
Harada
Yoshiki
Y
Ihara
Shigeru
S
Kasahara
Kohei
K
Shimizu
Masanori
M
Ueoka
Tetsugi
T