title: Modulated angle beam ultrasonic spectroscopy for evaluation of imperfect interfaces and adhesive bonds.
abstract: An experimental method incorporating high frequency pulsed angle beam ultrasonic measurements modulated by low frequency vibrations of a bonded structure is described. This method uses parametric/nonlinear mixing between high and low frequencies to characterize adhesive degradation. It is demonstrated that good quality (undamaged) bonds exhibit little dependence of ultrasonic signature on the overlay of low frequency vibration loads; however, environmentally degraded or imperfect bonds exhibit strong modulation of the resonance frequency of the ultrasonic signal reflected from the bond. The results are interpreted using a model for normal and oblique wave interaction with two nonlinear interfaces separated by an adhesive layer under quasi-static stress modulation.
authors.affiliation: The Ohio State University, Edison Joining Technology Center, Nondestructive Evaluation Program, 1248 Arthur E. Adams Dr., Columbus, OH 43221, USA. rokhlin.2@osu.edu
authors.forename: S I
authors.initials: SI
authors.lastname: Rokhlin
authors.forename: L
authors.initials: L
authors.lastname: Wang
authors.forename: B
authors.initials: B
authors.lastname: Xie
authors.forename: V A
authors.initials: VA
authors.lastname: Yakovlev
authors.forename: L
authors.initials: L
authors.lastname: Adler