title: Configurations of high-frequency ultrasonics complex vibration systems for packaging in microelectronics.
abstract: Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk.
authors.affiliation: Faculty of Engineering, Kanagawa University, 3-27-1 Rokkakubashi, Kanagawa-ku, Yokohama 221-8686, Japan. tsujino@cc.kanagawa-u.ac.jp
authors.forename: Jiromaru
authors.initials: J
authors.lastname: Tsujino
authors.forename: Yoshiki
authors.initials: Y
authors.lastname: Harada
authors.forename: Shigeru
authors.initials: S
authors.lastname: Ihara
authors.forename: Kohei
authors.initials: K
authors.lastname: Kasahara
authors.forename: Masanori
authors.initials: M
authors.lastname: Shimizu
authors.forename: Tetsugi
authors.initials: T
authors.lastname: Ueoka