title: Interconnected reversible lab-on-a-chip technology.
abstract: Interconnected lab-on-a-chip modules with minimal dead volume have been developed resulting in the 'plug and play' concept based upon a reversible bonding process. This paper describes the detail of a chip to chip interconnection method, where devices have been aligned and bonded within 15 min and rapidly disassembled in under 5 min. The transport of fluorescein between the chip modules was used as a model microfluidic system and analysed in order to demonstrate the electrophoretic performance of the device and the interconnected junction. Using this technology, in the future different modules for various applications can be developed and interconnected, depending on the required applications. In addition, this simple but rapid method of chip to chip connection overcomes potential problems associated with integrating incompatible materials on one device.
authors.affiliation: Department of Electronics and Electrical Engineering, University of Glasgow, Rankine Building, Oakfield Avenue, Glasgow, UKG12 8LT.
authors.forename: E
authors.initials: E
authors.lastname: Igata
authors.forename: M
authors.initials: M
authors.lastname: Arundell
authors.forename: H
authors.initials: H
authors.lastname: Morgan
authors.forename: J M
authors.initials: JM
authors.lastname: Cooper