[The arthroscopic "wafer procedure" in degenerative disc ulnocarpal tears with ulnocarpal compression syndrome. Techniques, indications, results].
The wafer procedure is a technique involving the partial resection of the distal ulna for the treatment of patients with symptomatic tears of the TFCC, for ulnar abutment syndrome or both. The TFCC-tears are classified as Palmer type 2. The wafer procedure can be performed as an open procedure or arthroscopically. It is an alternative to a shortening osteotomy of the ulna and decompresses the ulnocarpal joint. In ten cases with long-term follow-up, the preferability of the arthroscopic method is demonstrated: a minimally invasive technique, optimal assessment of all lesions, maximum protection of all uninjured structures in comparison to the open method, single stage procedure, and low complication rate. The long-term results are predominantly positive, so that the arthroscopic wafer procedure should be performed more often than it is today.
Feldkamp
G
G
Ambulantes Op.-Zentrum, Bochum. gfeldkamp@t-online.de
D000328:Adult; D000368:Aged; D001182:Arthroscopy / Q000379:methods*; D002357:Cartilage Diseases / Q000601:surgery*; D002358:Cartilage, Articular / Q000601:surgery*; D005260:Female; D006801:Humans; D007592:Joint Diseases / Q000601:surgery*; D008297:Male; D008875:Middle Aged; D019060:Minimally Invasive Surgical Procedures / Q000379:methods*; D017410:Practice Guidelines as Topic; D013577:Syndrome; D016896:Treatment Outcome; D014955:Wrist Joint / Q000601:surgery*