title: Electron microscopy observation of interface in diffusion-bonded copper joint.
abstract: The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.
authors.affiliation: Graduate School of Science and Technology, Niigata University, Niigata 950-2181, Japan. wangairu@gs.niigata-u.ac.jp
authors.forename: Airu
authors.initials: A
authors.lastname: Wang
authors.forename: Osamu
authors.initials: O
authors.lastname: Ohashi
authors.forename: Norio
authors.initials: N
authors.lastname: Yamaguchi
authors.forename: Guoqiang
authors.initials: G
authors.lastname: Xie
authors.forename: Minghui
authors.initials: M
authors.lastname: Song
authors.forename: Kazuo
authors.initials: K
authors.lastname: Furuya
authors.forename: Yasuo
authors.initials: Y
authors.lastname: Higashi
authors.forename: Nobuteru
authors.initials: N
authors.lastname: Hitomi