An ultraviolet-curable mold for sub-100-nm lithography.
We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.
Choi
Se-Jin
SJ
Minuta Tech, Center for Biotechnology Incubating, Shillim-dong, Kwanak-Gu, Seoul 151-742, Korea.
Yoo
Pil J
PJ
Baek
Seung J
SJ
Kim
Tae W
TW
Lee
Hong H
HH