Temperature-induced gelation of concentrated silicon carbide suspensions.
Due to the steric barrier provided by the adsorption of the dispersant hypermer KD1 (a polyester/polyamine condensation polymer), stable and low-viscosity suspensions of SiC, Y(2)O(3), and Al(2)O(3) powder mixtures could be prepared in methyl ethyl ketone (MEK)/ethanol (E) solvent with solids loading as high as 60 vol%. The solvency of the dispersant in MEK/E decreased dramatically on cooling. Steady shear viscosity and oscillatory measurements were performed as a function of temperature for suspensions with different solids loading. The viscosity and elastic modulus of suspension increased with decreasing temperature and became more sensitive with the increase of solids loading. The suspensions with solids loading higher than 40 vol% could be solidified with decreasing temperature, but gelation temperature and gelation stiffness decreased with decreasing solids loading. The 60 vol% solid-loaded suspension was a stable and free-flowing fluid at 20 degrees C and gradually transformed to a very highly viscous and elastic system upon cooling to about 13 degrees C. Complete solidification occurred when the temperature was decreased to 5 degrees C. The gelation mechanism was mainly based on the collapse of the adsorbed layer as the temperature decreases, which induced incipient flocculation and formed a stiff network. The gelled body was further strengthened by separation of the dispersant from the suspension.
Xu
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Department of Ceramics and Glass Engineering, CICECO, University of Aveiro, 3810-193 Aveiro, Portugal.
Mei
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Ferreira
J M F
JM
Nishimura
T
T
Hirosaki
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N
D017554:Carbon Compounds, Inorganic / Q000737:chemistry*; D005782:Gels; D017655:Silicon Compounds / Q000737:chemistry*; D013499:Surface Properties; D013535:Suspensions / Q000737:chemistry*; D013696:Temperature
D017554:Carbon Compounds, Inorganic; D005782:Gels; D017655:Silicon Compounds; D013535:Suspensions; C022088:silicon carbide