Direct patterning of copper on polyimide using ion exchangeable surface templates generated by site-selective surface modification.
We demonstrate site-selective chemical surface modification by dispensing potassium hydroxide solution onto polyimide, which confines source metallic ions that can subsequently be used in resist- and mask-free fabrication of copper circuit patterns. Metallization can be achieved by a wet chemical method, providing control over metal/polymer interfacial structures. Because the approach is compatible with other existing printing technologies and much simpler than conventional lithography-based methods, we propose that the present surface template method may be of general application in fabrication of metallized polymers as well as in development of integrated circuits with a variety of electronic circuit elements.
Akamatsu
Kensuke
K
Faculty of Science and Engineering, and Graduate School of Science, Konan University, 8-9-1 Okamoto, Higashinada, Kobe 658-8501, Japan. akamatsu@center.konan-u.ac.jp
Ikeda
Shingo
S
Nawafune
Hidemi
H
Yanagimoto
Hiroshi
H