Surfactants as part of a combined etchant and activator solution prior to the use of an anaerobic adhesive.
OBJECTIVE
The objectives of this experiment were to determine whether the incorporation of a surfactant into a combined etchant and activator solution would further promote the polymerization of an anaerobic adhesive.


METHODS
Stainless steel attachments were bonded to human enamel using an anaerobic adhesive. In each case the enamel was etched and activated using a solution of 37% o-phosphoric acid containing copper (II) sulphates or chlorides with one of three surfactants also within the solution. After bench curing, the specimens were shear bond tested to failure and the load at debond recorded in each case.


RESULTS
The results were analysed using Kaplan-Meier survival probabilities and log-rank tests along with a multiple comparison test, using Bonferroni's method.


CONCLUSIONS
Under the conditions of this experiment the addition of a surfactant to a combined etchant activator solution of 37% o-phosphoric acid and either copper (II) sulphate or copper (II) chloride, prior to the use of an anaerobic adhesive can have a significant effect on measured force to debond. However, with copper (II) sulphate the highest force to debond was observed with the control solution without a surfactant. With copper (II) chloride the surfactant Tween 20 increased the observed force to debond but the effect was not statistically significant.


CONCLUSIONS
Although it is possible to render the enamel surface both retentive and active towards anaerobic adhesives using a combined etchant and activator solution, the addition of a surfactant has little or no beneficial effect.
Ireland
Anthony J
AJ
Department of Orthodontics, Royal United Hospital, Combe Park, Bath BA1 3NG, UK. tony.ireland@bristol.ac.uk
Ireland
Martin J
MJ
Sherriff
Martyn
M
D000134:Acid Etching, Dental / Q000379:methods*; D000269:Adhesives / Q000737:chemistry; D017438:Bisphenol A-Glycidyl Methacrylate; D003300:Copper / Q000494:pharmacology; D019327:Copper Sulfate / Q000494:pharmacology; D001840:Dental Bonding; D003743:Dental Enamel / Q000187:drug effects*; D003799:Dental Stress Analysis; D006801:Humans; D008422:Materials Testing; D009967:Orthodontic Appliances; D044367:Phase Transition; D010756:Phosphoric Acids / Q000494:pharmacology; D011136:Polysorbates / Q000494:pharmacology*; D019279:Resin Cements / Q000737:chemistry; D033081:Shear Strength; D013193:Stainless Steel; D013501:Surface-Active Agents / Q000494:pharmacology*; D016019:Survival Analysis
D000269:Adhesives; C400047:Perma Metal; D010756:Phosphoric Acids; D011136:Polysorbates; D019279:Resin Cements; D013501:Surface-Active Agents; D013193:Stainless Steel; D017438:Bisphenol A-Glycidyl Methacrylate; D003300:Copper; C030242:phosphoric acid; D019327:Copper Sulfate; C029892:cupric chloride