Side-milling technique of preparing device cross-sections for electron holography based on a focused ion beam micro-sampling system.
A new milling technique based on a focused ion beam (FIB) microsampling system is proposed to avoid the curtaining effect, commonly occurring in other FIB milling methods, in order to obtain a crosssectional device specimen with uniform thickness can be obtained for electron holographic observation.
Wang
Zhouguang
Z
Kato
Takeharu
T
Hirayama
Tsukasa
T
D006696:Holography; D046529:Microscopy, Electron, Transmission; D012825:Silicon; D013048:Specimen Handling / Q000379:methods*
D012825:Silicon