A new FIB fabrication method for micropillar specimens for three-dimensional observation using scanning transmission electron microscopy.
A new method to prepare micropillar specimens with a high aspect ratio that is suitable for three-dimensional scanning transmission electron microscopy (3D-STEM) was developed. The key features of the micropillar fabrication are: first, microsampling to extract a small piece including the structure of interest in an IC chip, and second, an ion-beam with an incident direction of 60 degrees to the pillar's axis that enables the parallel sidewalls of the pillar to be produced with a high aspect ratio. A memory-cell structure (length: 6 microm; width: 300 x 500 nm) was fabricated in the micropillar and observed from various directions with a 3D-STEM. A planiform capacitor covered with granular surfaces and a solid crossing gate and metal lines was successfully observed threedimensionally at a resolution of approximately 5 nm.
Fukuda
Muneyuki
M
Central Research Laboratory, Hitachi Ltd., 1-280 Higashi-koigakubo, Kokubunji-shi, Tokyo 185-8601, Japan. fukuda-m@crl.hitachi.co.jp
Tomimatsu
Satoshi
S
Nakamura
Kuniyasu
K
Koguchi
Masanari
M
Shichi
Hiroyasu
H
Umemura
Kaoru
K
D021621:Imaging, Three-Dimensional; D017348:Microscopy, Electron, Scanning Transmission; D013048:Specimen Handling / Q000379:methods*