title: Modeling of viscous damping of perforated planar microstructures. Applications in acoustics.
abstract: The paper contains an analysis of the viscous damping in perforated planar microstructures that often serve as backplates or protecting surfaces in capacitive microsensors. The focus of this work is on planar surfaces containing an offset system of periodic oval holes or its limit cases: a system of circular holes or of slits. The viscous damping is calculated as the sum of squeeze film and the holes' resistances. The optimum number of holes is determined which minimizes the total viscous damping for a given percentage of open area. Graphs and formulas are provided for designing these devices. In the case the open area is higher than 15% the numerical results show that the influence of the holes' geometry (circular or oval) has a slight influence on viscous damping. As the planar structures containing oval holes assure a better protection against dust particles and water drops, they should be preferred in designing protective surfaces for microphones working in a natural environment. The obtained results also can be applied in designing other MEMS devices that use capacitive sensing such as accelerometers, micromechanical switches, resonators, and tunable microoptical interferometers.
authors.affiliation: Department of Mechanical Engineering, SUNY Binghamton, New York 13902-6000, USA. homentco@binghamton.edu
authors.forename: Dorel
authors.initials: D
authors.lastname: Homentcovschi
authors.forename: Ronald N
authors.initials: RN
authors.lastname: Miles
mesh_terms: D000162:Acoustics / Q000295:instrumentation; D005740:Gases / Q000737:chemistry*; D008433:Mathematics; D016012:Poisson Distribution; D011312:Pressure; D014783:Viscosity
chemical_list: D005740:Gases