Evaluation of depth of cure and Knoop hardness in a dental composite photo-activated using different methods.
The aim of this study was to evaluate the depth of cure and Knoop hardness in the P60 composite resin photo-activated using different methods. A bipartite brass matrix (3 mm in diameter X 11 mm in height) was filled with the composite and photo-activation was performed using continuous light, exponential light, intermittent light, plasma arc curing (PAC) or light-emitting diodes (LED). After opening the matrix, the uncured material was removed with a steel spatula and the polymerized composite was measured using a pachymeter. The specimens were then included in self-curing acrylic resin and worn longitudinally and the hardness was measured on the surface and at depths of 1, 2, 3, 4 and 5 mm. The data were analyzed by ANOVA and Tukey's test (5%). The results showed that the depth of cure was higher with the intermittent light, followed by continuous light, exponential light, PAC and LED methods. Up to a depth of 2 mm, all methods revealed similar hardness values, but there were differences between them at other depths, at which LED demonstrated the lowest values followed by PAC.
Obici
Andresa Carla
AC
School of Dentistry of Piracicaba, UNICAMP, Piracicaba, SP, Brazil.
Sinhoreti
Mário Alexandre Coelho
MA
Correr Sobrinho
Lourenço
L
de Goes
Mario Fernando
MF
Consani
Simonides
S
D017554:Carbon Compounds, Inorganic / Q000737:chemistry; D003188:Composite Resins / Q000737:chemistry* / Q000528:radiation effects; D055117:Curing Lights, Dental; D003764:Dental Materials / Q000737:chemistry* / Q000528:radiation effects; D003775:Dental Polishing / Q000295:instrumentation; D006244:Hardness; D006801:Humans; D008027:Light; D055115:Light-Curing of Dental Adhesives / Q000379:methods*; D008422:Materials Testing; D011108:Polymers / Q000737:chemistry / Q000528:radiation effects; D011829:Radiation Dosage; D012825:Silicon / Q000737:chemistry; D013499:Surface Properties; D013997:Time Factors
D017554:Carbon Compounds, Inorganic; D003188:Composite Resins; D003764:Dental Materials; C438835:Filtek P60 Composite Resin; D011108:Polymers; C517455:carborundum; D012825:Silicon