title: Through-mask anodic patterning of copper surfaces and film stability in biological media.
authors.affiliation: Department of Chemical Engineering, University of Washington, Seattle, Washington 98195-1750, USA.
authors.forename: Haixia
authors.initials: H
authors.lastname: Dai
authors.forename: Corrine K
authors.initials: CK
authors.lastname: Thai
authors.forename: Mehmet
authors.initials: M
authors.lastname: Sarikaya
authors.forename: François
authors.initials: F
authors.lastname: Baneyx
authors.forename: Daniel T
authors.initials: DT
authors.lastname: Schwartz
mesh_terms: D002021:Buffers; D002448:Cell Adhesion; D003300:Copper / Q000737:chemistry*; D004563:Electrochemistry; D004926:Escherichia coli / Q000166:cytology; D006878:Hydroxides / Q000737:chemistry; D008954:Models, Biological; D013059:Spectrum Analysis, Raman; D013696:Temperature
chemical_list: D002021:Buffers; D006878:Hydroxides; D003300:Copper; C031356:hydroxide ion