Through-mask anodic patterning of copper surfaces and film stability in biological media.
Dai
Haixia
H
Department of Chemical Engineering, University of Washington, Seattle, Washington 98195-1750, USA.
Thai
Corrine K
CK
Sarikaya
Mehmet
M
Baneyx
François
F
Schwartz
Daniel T
DT
D002021:Buffers; D002448:Cell Adhesion; D003300:Copper / Q000737:chemistry*; D004563:Electrochemistry; D004926:Escherichia coli / Q000166:cytology; D006878:Hydroxides / Q000737:chemistry; D008954:Models, Biological; D013059:Spectrum Analysis, Raman; D013696:Temperature
D002021:Buffers; D006878:Hydroxides; D003300:Copper; C031356:hydroxide ion