title: Rupture of thin stagnant films on a solid surface due to random thermal and mechanical perturbations.
abstract: A generalized formalism for the rupture of a nondraining thin film on a solid support due to imposed random thermal and mechanical perturbations, modeled as a Gaussian white noise, is presented. The evolution of amplitude of perturbation is described by a stochastic differential equation. The average film rupture time is the average time for the amplitude of perturbation to equal to the film thickness and is calculated by employing a first passage time analysis for different amplitudes of imposed perturbations, wavenumbers, film thickness, van der Waals and electrostatic interactions and surface tensions. The results indicate the existence of an optimum wavenumber at which the rupture time is minimum. A critical film thickness is identified based on the sign of the disjoining pressure gradient, below which the film is unstable in that the rupture time is very small. The calculated values of rupture time as well as the optimum wavenumber in the present analysis agree well with the results of linear stability analysis for immobile as well as completely mobile gas-liquid film interfaces. For stable films, the rupture time is found to increase dramatically with film thickness near the critical film thickness. As expected, the average rupture time was found to be higher for smaller amplitudes of imposed perturbations, larger surface potentials, larger surface tensions and smaller Hamaker constants.
authors.affiliation: Biochemical and Food Process Engineering, Department of Agricultural and Biological Engineering, Purdue University, West Lafayette, IN 47907, USA. narsimha@ecn.purdue.edu
authors.forename: Ganesan
authors.initials: G
authors.lastname: Narsimhan
mesh_terms: D000465:Algorithms; D055598:Chemical Phenomena; D002627:Chemistry, Physical; D008567:Membranes, Artificial; D008956:Models, Chemical; D013499:Surface Properties
chemical_list: D008567:Membranes, Artificial