title: Materials science. Electronics without lead.
abstract: In conventional consumer electronics such as cell phones, lead-containing interconnects provide the conductive path between different circuit elements. Environmental concerns have led to a search for lead-free alternatives. In their Perspective, Li et al. review these efforts, which have focused on lead-free alloys and electrically conductive adhesives. Both of these approaches are showing promise, but no one lead-free interconnect material can serve as a substitute for the conventional tin-lead solder in all devices.
authors.affiliation: School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA. cp.wong@mse.gatech.edu
authors.forename: Yi
authors.initials: Y
authors.lastname: Li
authors.forename: Kyoung-sik
authors.initials: KS
authors.lastname: Moon
authors.forename: C P
authors.initials: CP
authors.lastname: Wong